International conference on wafer bonding for MEMS technologies and wafer level integration
نویسندگان
چکیده
منابع مشابه
Bonding and contacting of MEMS-structures on wafer level
Effective and cost favorable procedures for hermetical encapsulation of MEMS-structures on wafer level can be fabricated by wafer bonding technologies like the seal glass bonding and by suitable connection technologies routing the electrical potential through the chip structure. Within the paper the parameters of the print and bonding process will be presented and the print process limits will ...
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Direct wafer bonding is a method for fabricating advanced substrates for microelectromechanical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer. SOI wafers offer many advantages over conventional silicon wafers. In IC technology, the switching speed of circuits fabricated on SOI is increased by 20-50% co...
متن کاملCost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based ...
متن کاملWafer Level Surface Activated Bonding Tool for MEMS Packaging
A wafer level surface activated bonding ~SAB! tool has been developed for microelectromechanical systems ~MEMS! packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within 61 mm and the X, Y, and u axis alignments with an accuracy of 60.5 mm. We have approached a new ...
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ژورنال
عنوان ژورنال: Microsystem Technologies
سال: 2017
ISSN: 0946-7076,1432-1858
DOI: 10.1007/s00542-017-3665-5